1. half slice cut:

Current density reduced by 1/2.

The internal power loss is reduced to 1/4 of conventional components.

Rated output power increased by 5-10W.

Whole piece: P=I^2R.

Half slice: P=(I/2)^2R.

2. shade but not energy:

Up and down symmetrical parallel component design.

Effectively, the current mismatch caused by children's twitching is as follows, and the output of power generation is increased from 0 to 50%6.

Whole chip: 0 power output.

Half a chip: 50% power output.

3. multiple bus bars:

The grid lines are densely distributed, and the force is uniform, and the output power of the multi-busbar design is increased by more than 5W.

4. new welding wire:

Using round wire ribbon, the shading area is reduced.

The incident light is reflected multiple times, increasing the power by 1-2W.

5. High Density Packaging Technology:

Using advanced high-density packaging technology.

Guaranteed the perfect balance of efficiency and reliability.

Module efficiency increased by more than 0.15%.